Electrolytic Tough Pitch Copper - CDA 110

Element 

Composition

Copper (Cu) + Silver (Ag)

99.90% min

Oxygen (O)

0.04%

Property

Value

Color

Copper

Melting Point (Solidus)

1981°F (1083°C)

Flow Point (Liquidus)

1981°F (1083°C)

Specific Gravity

8.94

Density

0.323 lbs/in³

Electrical Conductivity

101% IACS (minimum)

Electrical Resistivity

1.71 microhm-cm

Thermal Conductivity

226 BTU/(sq ft-ft-hr-°F)

Specific Heat

0.092 BTU/lb/°F @ 68°F

Thermal Expansion

9.4 × 10⁻⁶ per °F (from 68°F to 212°F)

Modulus of Elasticity

17,000 ksi

Property

Annealed (-O)

Light Drawn (-H00)

1/4 Hard (-H01)

1/2 Hard (-H02)

Hard Drawn (-H04)

Ultimate Tensile Strength

32 ksi

36 ksi

38 ksi

42 ksi

50 ksi

Yield Tensile Strength

10 ksi

28 ksi

30 ksi

36 ksi

45 ksi

Shear Strength

22 ksi

25 ksi

25 ksi

26 ksi

28 ksi

Elongation at Break

55%

33%

22%

14%

20%

Hardness (Rockwell)

B10

B10

B25

B40

B50

Hardness (Brinell)

57

57

64

74

83

Modulus of Elasticity

17,000 ksi

16,700-18,900 ksi

16,700-18,900 ksi

16,700-18,900 ksi

16,700-18,900 ksi

Shear Modulus

6,300 ksi

6,300 ksi

6,300 ksi

6,300 ksi

6,300 ksi

Property

Value

Thermal Conductivity

391 W/m·K (226 BTU/(sq ft-ft-hr-°F))

Specific Heat

0.385 J/g·K (0.092 BTU/lb/°F @ 68°F)

Thermal Expansion Coefficient

17 μstrain/°C (9.4 × 10⁻⁶ per °F from 68°F to 212°F)

Melting Point (Solidus)

1083°C (1981°F)

Flow Point (Liquidus)

1083°C (1981°F)

Melting Range

1070 to 1080°C

Brazing Temperature Range

1093°C - 1177°C (2000°F - 2150°F)

Property

Value

Cold Working Capacity

Excellent

Hot Forming Capacity

Excellent

Hot Forgeability Rating

Not provided for CDA 110

Hot Working Temperature Range

Not provided for CDA 110

Annealing Temperature Range

Not provided for CDA 110

Machinability Rating

Not provided for CDA 110

Brazing Temperature Range

2000°F - 2150°F (1093°C - 1177°C)

Solderability

Good (inferred from general copper properties)

Weldability

Good (inferred from general copper properties)