Oxygen Free Electronic Copper - CDA 101

Element

Composition (%)

Copper (Cu)

99.99 min.

Oxygen (O)

0.0005 max.

Lead (Pb)

0.0005 max.

Bismuth (Bi)

0.0001 max.

Silver (Ag)

0.0025 max.

Other Elements (total)

0.0010 max.

Property

Value

Melting Point

1981°F (1083°C)

Density

8.94 g/cm³ (0.323 lb/in³)

Specific Heat

385 J/kg·K (0.092 BTU/lb·°F)

Thermal Conductivity

399 W/m·°C (2710 BTU·in/hr·ft²·°F)

Thermal Expansion Coefficient (20-200°C)

17.3 × 10⁻⁶ /°C

Electrical Conductivity

101% IACS (minimum)

Electrical Resistivity

1.71 microhm·cm (0.017 microhm·m)

Modulus of Elasticity

17,000 ksi (118,000 N/mm²)

Poisson's Ratio

0.34

Property

Value

Tensile Strength (Annealed)

220-250 MPa (32-36 ksi)

Yield Strength (Annealed)

60-70 MPa (9-10 ksi)

Elongation at Break

45-55%

Hardness (Vickers)

45-55 HV

Elastic Modulus

120 GPa (17.4 × 10⁶ psi)

Poisson's Ratio

0.34

Fatigue Strength

62 MPa (9 ksi) at 10⁸ cycles

Impact Strength

60-70 J (44-52 ft-lb)

Shear Modulus

44.7 GPa (6.48 × 10⁶ psi)

Shear Strength

170 MPa (24.7 ksi)

Property

Value

Thermal Conductivity

391-394 W/m·K (2710 BTU·in/hr·ft²·°F)

Specific Heat

385 J/kg·K (0.092 BTU/lb·°F)

Thermal Expansion Coefficient (20-200°C)

17.3 × 10⁻⁶ /°C

Melting Point

1083°C (1981°F)

Solidus Temperature

1083°C (1981°F)

Liquidus Temperature

1083°C (1981°F)

Hot Working Temperature Range

760-871°C (1400-1600°F)

Annealing Temperature Range

371-649°C (700-1200°F)

Property

Value

Machinability

20% (of free-cutting brass)

Hot Working Temperature Range

760-871°C (1400-1600°F)

Hot Formability

Excellent

Cold Formability

Excellent

Cold Reduction Between Anneals

95% max.

Annealing Temperature Range

371-649°C (700-1200°F)

Forging Temperature Range

760-871°C (1400-1600°F)

Forging Rate

65%

Soldering

Excellent

Brazing

Excellent

Gas Shielded Arc Welding

Excellent

Oxyacetylene Welding

Good

Butt Welding

Good

Coated Metal Arc Welding

Not recommended

Spot Welding

Not recommended

Seam Welding

Not recommended